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1 Ergebnisse
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Microstructure evolution and growth kinetics of intermetall..:
Chen, Yuanming
;
Huang, Junjie
;
Huang, Yunzhong
...
Journal of Materials Science: Materials in Electronics. 35 (2024) 4 - p. , 2024
Link:
https://doi.org/10.1007/s10854-024-12043-3
RT Journal T1 <Title>Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-024-12043-3&Exemplar=1&LAN=DE A1 Chen, Yuanming A1 Huang, Junjie A1 Huang, Yunzhong A1 Li, Qingyuan A1 Zeng, Hong A1 Tian, Ling A1 Li, Jingsong A1 Wang, Shouxu A1 He, Wei A1 Hong, Yan PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 4 LK http://dx.doi.org/https://doi.org/10.1007/s10854-024-12043-3 DO https://doi.org/10.1007/s10854-024-12043-3 SF ELIB - SuUB Bremen
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