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1 Ergebnisse
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Compound additives and stress study of EDTA-2Na chemical co..:
Li, Xinwei
;
Zhao, Wenxia
;
Cheng, Yi
...
Journal of Materials Science: Materials in Electronics. 35 (2024) 7 - p. , 2024
Link:
https://doi.org/10.1007/s10854-024-12283-3
RT Journal T1 <Title>Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-024-12283-3&Exemplar=1&LAN=DE A1 Li, Xinwei A1 Zhao, Wenxia A1 Cheng, Yi A1 Liu, Xin A1 Hui, Kaihong A1 Zhao, Wei A1 Song, Yifan A1 Zhu, Qian A1 Chen, Huaijun A1 Cui, Yubo PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 7 LK http://dx.doi.org/https://doi.org/10.1007/s10854-024-12283-3 DO https://doi.org/10.1007/s10854-024-12283-3 SF ELIB - SuUB Bremen
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