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1 Ergebnisse
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Microstructure and growth of Cu hillock on redistribution l..:
Huang, Yen-Cheng
;
Tsai, Min-Yan
;
Lin, Ting-Chun
...
Journal of Materials Science: Materials in Electronics. 35 (2024) 9 - p. , 2024
Link:
https://doi.org/10.1007/s10854-024-12407-9
RT Journal T1 <Title>Microstructure and growth of Cu hillock on redistribution line under electromigration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-024-12407-9&Exemplar=1&LAN=DE A1 Huang, Yen-Cheng A1 Tsai, Min-Yan A1 Lin, Ting-Chun A1 Lin, Yung-Sheng A1 Hung, Chi-Pin A1 Lin, Kwang-Lung PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 9 LK http://dx.doi.org/https://doi.org/10.1007/s10854-024-12407-9 DO https://doi.org/10.1007/s10854-024-12407-9 SF ELIB - SuUB Bremen
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