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1 Ergebnisse
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The feasibility study of replacing the traditional amorphou..:
Xing, Jing
;
Yao, Jinye
;
Zhao, Yuanbang
...
Journal of Materials Science: Materials in Electronics. 35 (2024) 12 - p. , 2024
Link:
https://doi.org/10.1007/s10854-024-12457-z
RT Journal T1 <Title>The feasibility study of replacing the traditional amorphous Ni-P with an amorphous Ni-Cu-P layer</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-024-12457-z&Exemplar=1&LAN=DE A1 Xing, Jing A1 Yao, Jinye A1 Zhao, Yuanbang A1 Xia, Haohao A1 Wang, Li A1 Chen, Xiangxu A1 Ma, Haitao A1 Wang, Yunpeng A1 Ma, Haoran PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 12 LK http://dx.doi.org/https://doi.org/10.1007/s10854-024-12457-z DO https://doi.org/10.1007/s10854-024-12457-z SF ELIB - SuUB Bremen
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