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Electrochemical deposition of Sn-0.7Cu alloy modified with ..:
Lee, Gyeong Ah
;
Sharma, Ashutosh
;
Jung, Jae Pil
Journal of Materials Science: Materials in Electronics. 35 (2024) 14 - p. , 2024
Link:
https://doi.org/10.1007/s10854-024-12606-4
RT Journal T1 <Title>Electrochemical deposition of Sn-0.7Cu alloy modified with nano-WO3 for high-density mini-LED packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-024-12606-4&Exemplar=1&LAN=DE A1 Lee, Gyeong Ah A1 Sharma, Ashutosh A1 Jung, Jae Pil PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 14 LK http://dx.doi.org/https://doi.org/10.1007/s10854-024-12606-4 DO https://doi.org/10.1007/s10854-024-12606-4 SF ELIB - SuUB Bremen
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