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1 Ergebnisse
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Electroplating of Cu/Sn bumps with ultrafine pitch and high..:
Luo, Canlin
;
Lin, Chang
;
Ye, Jinyu
...
Journal of Materials Science: Materials in Electronics. 35 (2024) 12 - p. , 2024
Link:
https://doi.org/10.1007/s10854-024-12645-x
RT Journal T1 <Title>Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-024-12645-x&Exemplar=1&LAN=DE A1 Luo, Canlin A1 Lin, Chang A1 Ye, Jinyu A1 Zeng, Huangjie A1 Zhou, Xiongtu A1 Wu, Chaoxing A1 Zhang, Yongai A1 Sun, Jie A1 Guo, Tailiang A1 Yan, Qun PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 12 LK http://dx.doi.org/https://doi.org/10.1007/s10854-024-12645-x DO https://doi.org/10.1007/s10854-024-12645-x SF ELIB - SuUB Bremen
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