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Formation of copper lines on dielectric substrates by the t..:
Bezuglyi, B. A.
;
Denisov, M. M.
;
Tarasov, O. A.
Journal of Engineering Physics and Thermophysics. 80 (2007) 2 - p. 409-415 , 2007
Link:
https://doi.org/10.1007/s10891-007-0054-4
RT Journal T1 <Title>Formation of copper lines on dielectric substrates by the thermotensography method</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10891-007-0054-4&Exemplar=1&LAN=DE A1 Bezuglyi, B. A. A1 Denisov, M. M. A1 Tarasov, O. A. PB Springer Science and Business Media LLC YR 2007 SN 1062-0125 SN 1573-871X JF Journal of Engineering Physics and Thermophysics VO 80 IS 2 SP 409 OP 415 LK http://dx.doi.org/https://doi.org/10.1007/s10891-007-0054-4 DO https://doi.org/10.1007/s10891-007-0054-4 SF ELIB - SuUB Bremen
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