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1 Ergebnisse
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The Hillock Formation in a Cu/Sn-9Zn/Cu Lamella upon Curren..:
Kuo, Shih-Ming
;
Lin, Kwang-Lung
Journal of Electronic Materials. 36 (2007) 10 - p. 1378-1382 , 2007
Link:
https://doi.org/10.1007/s11664-007-0209-2
RT Journal T1
The Hillock Formation in a Cu/Sn-9Zn/Cu Lamella upon Current Stressing
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11664-007-0209-2&Exemplar=1&LAN=DE A1 Kuo, Shih-Ming A1 Lin, Kwang-Lung PB Springer Science and Business Media LLC YR 2007 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 36 IS 10 SP 1378 OP 1382 LK http://dx.doi.org/https://doi.org/10.1007/s11664-007-0209-2 DO https://doi.org/10.1007/s11664-007-0209-2 SF ELIB - SuUB Bremen
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