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Thermomechanical Reliability Study of Benzocyclobutene Film..:
Lee, K.-O.
Journal of Electronic Materials. 41 (2012) 4 - p. 706-711 , 2012
Link:
https://doi.org/10.1007/s11664-012-1944-6
RT Journal T1 <Title>Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11664-012-1944-6&Exemplar=1&LAN=DE A1 Lee, K.-O. PB Springer Science and Business Media LLC YR 2012 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 41 IS 4 SP 706 OP 711 LK http://dx.doi.org/https://doi.org/10.1007/s11664-012-1944-6 DO https://doi.org/10.1007/s11664-012-1944-6 SF ELIB - SuUB Bremen
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