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1 Ergebnisse
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Effect of the Thermal Annealing on the Stretchability and F..:
Lee, Dong-Jun
;
Lee, Jong-Sung
;
Kim, Tae-Wook
...
Journal of Electronic Materials. 48 (2019) 7 - p. 4582-4588 , 2019
Link:
https://doi.org/10.1007/s11664-019-07237-z
RT Journal T1
Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11664-019-07237-z&Exemplar=1&LAN=DE A1 Lee, Dong-Jun A1 Lee, Jong-Sung A1 Kim, Tae-Wook A1 Lee, So-Yeon A1 Park, Young-Bae A1 Joo, Young-Chang A1 Kim, Byoung-Joon PB Springer Science and Business Media LLC YR 2019 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 48 IS 7 SP 4582 OP 4588 LK http://dx.doi.org/https://doi.org/10.1007/s11664-019-07237-z DO https://doi.org/10.1007/s11664-019-07237-z SF ELIB - SuUB Bremen
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