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1 Ergebnisse
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A Model for Intermetallic Growth in Thin Sn Joints Between ..:
Arafat, Y.
;
Yang, H.
;
Dutta, I.
..
Journal of Electronic Materials. 49 (2020) 5 - p. 3367-3382 , 2020
Link:
https://doi.org/10.1007/s11664-020-08019-8
RT Journal T1 <Title>A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11664-020-08019-8&Exemplar=1&LAN=DE A1 Arafat, Y. A1 Yang, H. A1 Dutta, I. A1 Kumar, P. A. A1 Datta, B. PB Springer Science and Business Media LLC YR 2020 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 49 IS 5 SP 3367 OP 3382 LK http://dx.doi.org/https://doi.org/10.1007/s11664-020-08019-8 DO https://doi.org/10.1007/s11664-020-08019-8 SF ELIB - SuUB Bremen
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