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1 Ergebnisse
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Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Proces..:
Gao, Li-Yin
;
Cui, Xian-Wei
;
Tian, Fei-Fei
.
Journal of Electronic Materials. 49 (2020) 10 - p. 6223-6231 , 2020
Link:
https://doi.org/10.1007/s11664-020-08372-8
RT Journal T1
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11664-020-08372-8&Exemplar=1&LAN=DE A1 Gao, Li-Yin A1 Cui, Xian-Wei A1 Tian, Fei-Fei A1 Liu, Zhi-Quan PB Springer Science and Business Media LLC YR 2020 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 49 IS 10 SP 6223 OP 6231 LK http://dx.doi.org/https://doi.org/10.1007/s11664-020-08372-8 DO https://doi.org/10.1007/s11664-020-08372-8 SF ELIB - SuUB Bremen
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