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1 Ergebnisse
1
Effect of Bimodal Cu Paste on Interfacial Properties and Me..:
Son, Junhyuk
;
Yu, Dong-Yurl
;
Kim, Yun-Chan
..
Journal of Electronic Materials. 51 (2022) 12 - p. 7326-7336 , 2022
Link:
https://doi.org/10.1007/s11664-022-09770-w
RT Journal T1
Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11664-022-09770-w&Exemplar=1&LAN=DE A1 Son, Junhyuk A1 Yu, Dong-Yurl A1 Kim, Yun-Chan A1 Byun, Dongjin A1 Bang, Junghwan PB Springer Science and Business Media LLC YR 2022 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 51 IS 12 SP 7326 OP 7336 LK http://dx.doi.org/https://doi.org/10.1007/s11664-022-09770-w DO https://doi.org/10.1007/s11664-022-09770-w SF ELIB - SuUB Bremen
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