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1 Ergebnisse
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Study of the Electrical and Diffusion Barrier Properties in..:
Chang, Chang-Shuo
;
Wang, Da-Jiun
;
Li, Tse-Chang
...
Journal of Materials Engineering and Performance. 28 (2019) 4 - p. 2292-2304 , 2019
Link:
https://doi.org/10.1007/s11665-019-03976-6
RT Journal T1 <Title>Study of the Electrical and Diffusion Barrier Properties in Ultrathin Carbon Film-Coated Copper Microwires for Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11665-019-03976-6&Exemplar=1&LAN=DE A1 Chang, Chang-Shuo A1 Wang, Da-Jiun A1 Li, Tse-Chang A1 Shen, Chang-Hong A1 Jing, Yuan-Chou A1 Wu, Gien-Huang A1 Lin, Jen-Fin PB Springer Science and Business Media LLC YR 2019 SN 1059-9495 SN 1544-1024 JF Journal of Materials Engineering and Performance VO 28 IS 4 SP 2292 OP 2304 LK http://dx.doi.org/https://doi.org/10.1007/s11665-019-03976-6 DO https://doi.org/10.1007/s11665-019-03976-6 SF ELIB - SuUB Bremen
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