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1 Ergebnisse
1
Enhanced Thermal Conductivity and Tensile Strength of Coppe..:
Jia, Fei Long
;
Wei, Kun Xia
;
Wei, Wei
...
Journal of Materials Engineering and Performance. 30 (2021) 10 - p. 7682-7689 , 2021
Link:
https://doi.org/10.1007/s11665-021-05902-1
RT Journal T1 <Title>Enhanced Thermal Conductivity and Tensile Strength of Copper Matrix Composite with Few-Layer Graphene Nanoplates</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11665-021-05902-1&Exemplar=1&LAN=DE A1 Jia, Fei Long A1 Wei, Kun Xia A1 Wei, Wei A1 Chu, Fu Qiang A1 Du, Qing Bo A1 Alexandrov, Igor V. A1 Hu, Jing PB Springer Science and Business Media LLC YR 2021 SN 1059-9495 SN 1544-1024 JF Journal of Materials Engineering and Performance VO 30 IS 10 SP 7682 OP 7689 LK http://dx.doi.org/https://doi.org/10.1007/s11665-021-05902-1 DO https://doi.org/10.1007/s11665-021-05902-1 SF ELIB - SuUB Bremen
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