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1 Ergebnisse
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Numerical Simulation of the Cold Spray Deposition of Copper..:
Tang, Wei
;
Zhang, Jiayuan
;
Li, Yan
..
Journal of Thermal Spray Technology. 30 (2021) 7 - p. 1792-1809 , 2021
Link:
https://doi.org/10.1007/s11666-021-01254-3
RT Journal T1 <Title>Numerical Simulation of the Cold Spray Deposition of Copper Particles on Polyether Ether Ketone (PEEK) Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11666-021-01254-3&Exemplar=1&LAN=DE A1 Tang, Wei A1 Zhang, Jiayuan A1 Li, Yan A1 Yu, Bo A1 Zhao, Jiabin PB Springer Science and Business Media LLC YR 2021 SN 1059-9630 SN 1544-1016 JF Journal of Thermal Spray Technology VO 30 IS 7 SP 1792 OP 1809 LK http://dx.doi.org/https://doi.org/10.1007/s11666-021-01254-3 DO https://doi.org/10.1007/s11666-021-01254-3 SF ELIB - SuUB Bremen
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