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Thin film silver deposition by electroplating for ULSI inte..:
Seo, Joon-Mo
;
Cho, Sung Ki
;
Koo, Hyo-Chol
...
Korean Journal of Chemical Engineering. 26 (2009) 1 - p. 265-268 , 2009
Link:
https://doi.org/10.1007/s11814-009-0045-6
RT Journal T1 <Title>Thin film silver deposition by electroplating for ULSI interconnect applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s11814-009-0045-6&Exemplar=1&LAN=DE A1 Seo, Joon-Mo A1 Cho, Sung Ki A1 Koo, Hyo-Chol A1 Kim, Soo-Kil A1 Kwon, Oh Joong A1 Kim, Jae Jeong PB Springer Science and Business Media LLC YR 2009 SN 0256-1115 SN 1975-7220 JF Korean Journal of Chemical Engineering VO 26 IS 1 SP 265 OP 268 LK http://dx.doi.org/https://doi.org/10.1007/s11814-009-0045-6 DO https://doi.org/10.1007/s11814-009-0045-6 SF ELIB - SuUB Bremen
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