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Mathematical modeling based on contact mechanism due to ela..:
Kim, Hyunjin
;
Shin, Somin
;
Lee, Dasol
.
Journal of Mechanical Science and Technology. 34 (2020) 1 - p. 289-300 , 2020
Link:
https://doi.org/10.1007/s12206-019-1230-0
RT Journal T1 <Title>Mathematical modeling based on contact mechanism due to elastic and plastic deformation of pad asperities during CMP</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s12206-019-1230-0&Exemplar=1&LAN=DE A1 Kim, Hyunjin A1 Shin, Somin A1 Lee, Dasol A1 Jeong, Haedo PB Springer Science and Business Media LLC YR 2020 SN 1738-494X SN 1976-3824 JF Journal of Mechanical Science and Technology VO 34 IS 1 SP 289 OP 300 LK http://dx.doi.org/https://doi.org/10.1007/s12206-019-1230-0 DO https://doi.org/10.1007/s12206-019-1230-0 SF ELIB - SuUB Bremen
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