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1 Ergebnisse
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Interfacial void segregation of Cl in Cu-Sn micro-connects:
Ross, Glenn
;
Tao, Xiaoma
;
Broas, Mikael
...
Electronic Materials Letters. 13 (2017) 4 - p. 307-312 , 2017
Link:
https://doi.org/10.1007/s13391-017-6304-5
RT Journal T1
Interfacial void segregation of Cl in Cu-Sn micro-connects
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s13391-017-6304-5&Exemplar=1&LAN=DE A1 Ross, Glenn A1 Tao, Xiaoma A1 Broas, Mikael A1 Mäntyoja, Nikolai A1 Vuorinen, Vesa A1 Graff, Andreas A1 Altmann, Frank A1 Petzold, Matthias A1 Paulasto-Kröckel, Mervi PB Springer Science and Business Media LLC YR 2017 SN 1738-8090 SN 2093-6788 JF Electronic Materials Letters VO 13 IS 4 SP 307 OP 312 LK http://dx.doi.org/https://doi.org/10.1007/s13391-017-6304-5 DO https://doi.org/10.1007/s13391-017-6304-5 SF ELIB - SuUB Bremen
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