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1 Ergebnisse
1
Approaches to defect characterization, mitigation and reduc..:
, In:
Advances in Chemical Mechanical Planarization (CMP)
,
Tseng, Wei-Tsu
- p. 467-503 , 2022
Link:
https://doi.org/10.1016/b978-0-12-821791-7.00006-x
RT T1 <cTitle>Advances in Chemical Mechanical Planarization (CMP)</cTitle>: T1 <Title>Approaches to defect characterization, mitigation and reduction</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_b978-0-12-821791-7.00006-x&Exemplar=1&LAN=DE A1 Tseng, Wei-Tsu PB Elsevier YR 2022 SP 467 OP 503 LK http://dx.doi.org/https://doi.org/10.1016/b978-0-12-821791-7.00006-x DO https://doi.org/10.1016/b978-0-12-821791-7.00006-x SF ELIB - SuUB Bremen
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