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1 Ergebnisse
1
Transient copper removal rate phenomena with implications f..:
, In:
Advances in Chemical Mechanical Planarization (CMP)
,
Borucki, L.
;
Sampurno, Y.
;
Theng, S.
. - p. 237-257 , 2022
Link:
https://doi.org/10.1016/b978-0-12-821791-7.00007-1
RT T1 <cTitle>Advances in Chemical Mechanical Planarization (CMP)</cTitle>: T1 <Title>Transient copper removal rate phenomena with implications for polishing mechanisms</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_b978-0-12-821791-7.00007-1&Exemplar=1&LAN=DE A1 Borucki, L. A1 Sampurno, Y. A1 Theng, S. A1 Philipossian, A. PB Elsevier YR 2022 SP 237 OP 257 LK http://dx.doi.org/https://doi.org/10.1016/b978-0-12-821791-7.00007-1 DO https://doi.org/10.1016/b978-0-12-821791-7.00007-1 SF ELIB - SuUB Bremen
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