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Variation of poly-Si grain structures under thermal anneali..:
Hong, Suk Bum
;
Park, Ju Hyun
;
Lee, Tae Ho
...
Applied Surface Science. 477 (2019) - p. 104-110 , 2019
Link:
https://doi.org/10.1016/j.apsusc.2017.11.226
RT Journal T1
Variation of poly-Si grain structures under thermal annealing and its effect on the performance of TiN/Al2O3/Si3N4/SiO2/poly-Si capacitors
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.apsusc.2017.11.226&Exemplar=1&LAN=DE A1 Hong, Suk Bum A1 Park, Ju Hyun A1 Lee, Tae Ho A1 Lim, Jun Hee A1 Shin, Changhwan A1 Park, Young Woo A1 Kim, Tae Geun PB Elsevier BV YR 2019 SN 0169-4332 JF Applied Surface Science VO 477 SP 104 OP 110 LK http://dx.doi.org/https://doi.org/10.1016/j.apsusc.2017.11.226 DO https://doi.org/10.1016/j.apsusc.2017.11.226 SF ELIB - SuUB Bremen
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