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1 Ergebnisse
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Through-plane high thermal conducting networks via incorpor..:
Park, Kee-Ryung
;
Cho, Hong-Baek
;
Lim, Minseob
...
Applied Surface Science. 551 (2021) - p. 149201 , 2021
Link:
https://doi.org/10.1016/j.apsusc.2021.149201
RT Journal T1
Through-plane high thermal conducting networks via incorporation of graphene nanoplatelets in nanocomposite film under electric field and avoiding breakdown voltage
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.apsusc.2021.149201&Exemplar=1&LAN=DE A1 Park, Kee-Ryung A1 Cho, Hong-Baek A1 Lim, Minseob A1 Jang, Byung Kwon A1 Lee, Jongsik A1 Jeon, ByungSeo A1 Choa, Yong-Ho PB Elsevier BV YR 2021 SN 0169-4332 JF Applied Surface Science VO 551 SP 149201 LK http://dx.doi.org/https://doi.org/10.1016/j.apsusc.2021.149201 DO https://doi.org/10.1016/j.apsusc.2021.149201 SF ELIB - SuUB Bremen
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