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1 Ergebnisse
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Robust packaging of printed flexible electronics with funct..:
Kasi, Venkat
;
Masud Rana, Muhammad
;
Gopalakrishnan, Sarath
...
Applied Surface Science. 644 (2024) - p. 158671 , 2024
Link:
https://doi.org/10.1016/j.apsusc.2023.158671
RT Journal T1
Robust packaging of printed flexible electronics with functional SiOx coatings via cold atmospheric plasma assisted deposition
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.apsusc.2023.158671&Exemplar=1&LAN=DE A1 Kasi, Venkat A1 Masud Rana, Muhammad A1 Gopalakrishnan, Sarath A1 Heredia Rivera, Ulisses A1 Yoon, Jaewon A1 Cakmak, Mukerrem A1 Rahimi, Rahim PB Elsevier BV YR 2024 SN 0169-4332 JF Applied Surface Science VO 644 SP 158671 LK http://dx.doi.org/https://doi.org/10.1016/j.apsusc.2023.158671 DO https://doi.org/10.1016/j.apsusc.2023.158671 SF ELIB - SuUB Bremen
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