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1 Ergebnisse
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Enhancement of interfacial thermal conductance by introduci..:
Wu, Kongping
;
Zhang, Leng
;
Li, Fangzhen
...
Carbon. 223 (2024) - p. 119021 , 2024
Link:
https://doi.org/10.1016/j.carbon.2024.119021
RT Journal T1
Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.carbon.2024.119021&Exemplar=1&LAN=DE A1 Wu, Kongping A1 Zhang, Leng A1 Li, Fangzhen A1 Sang, Liwen A1 Liao, Meiyong A1 Tang, Kun A1 Ye, Jiandong A1 Gu, Shulin PB Elsevier BV YR 2024 SN 0008-6223 JF Carbon VO 223 SP 119021 LK http://dx.doi.org/https://doi.org/10.1016/j.carbon.2024.119021 DO https://doi.org/10.1016/j.carbon.2024.119021 SF ELIB - SuUB Bremen
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