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1 Ergebnisse
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Plasma-activated silicon–glass high-strength multistep bond..:
Yu, Mingzhi
;
Zhao, Libo
;
Wang, Yongliang
...
Chemical Engineering Journal. 471 (2023) - p. 144719 , 2023
Link:
https://doi.org/10.1016/j.cej.2023.144719
RT Journal T1
Plasma-activated silicon–glass high-strength multistep bonding for low-temperature vacuum packaging
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.cej.2023.144719&Exemplar=1&LAN=DE A1 Yu, Mingzhi A1 Zhao, Libo A1 Wang, Yongliang A1 Xia, Yong A1 Ma, Yintao A1 Wang, Yanbin A1 Han, Xiangguang A1 Chen, Yao A1 Lu, Shun A1 Luo, Guoxi A1 Zhu, Nan A1 Yang, Ping A1 Wang, Kaifei A1 Lin, Qijing A1 Jiang, Zhuangde PB Elsevier BV YR 2023 SN 1385-8947 JF Chemical Engineering Journal VO 471 SP 144719 LK http://dx.doi.org/https://doi.org/10.1016/j.cej.2023.144719 DO https://doi.org/10.1016/j.cej.2023.144719 SF ELIB - SuUB Bremen
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