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1 Ergebnisse
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Thermal interface materials with low modulus and high therm..:
Zhang, Zhian
;
Wen, Zhibin
;
Sheng, Jiashuo
...
Chemical Engineering Journal. 495 (2024) - p. 153352 , 2024
Link:
https://doi.org/10.1016/j.cej.2024.153352
RT Journal T1
Thermal interface materials with low modulus and high thermal conductivity by manipulating multi-branched PDMS network: The disentanglement and entanglement effect of dangling chain
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.cej.2024.153352&Exemplar=1&LAN=DE A1 Zhang, Zhian A1 Wen, Zhibin A1 Sheng, Jiashuo A1 Zeng, Chen A1 Fan, Jianfeng A1 Ren, Linlin A1 Zeng, Xiaoliang A1 Sun, Rong A1 Chen, Peng PB Elsevier BV YR 2024 SN 1385-8947 JF Chemical Engineering Journal VO 495 SP 153352 LK http://dx.doi.org/https://doi.org/10.1016/j.cej.2024.153352 DO https://doi.org/10.1016/j.cej.2024.153352 SF ELIB - SuUB Bremen
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