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Electroless plating of copper through successive pretreatme..:

Liu, Zheng-Chun ; He, Quan-Guo ; Hou, Peng...
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  257-258 (2005)  - p. 283-286 , 2005
Link: https://doi.org/10.1016/j.colsurfa.2004.10.036