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Dishing-free chemical mechanical planarization for copper f..:

Yun, Sang-Su ; Son, Young-Hye ; Jeong, Gi-ppeum...
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  616 (2021)  - p. 126143 , 2021
Link: https://doi.org/10.1016/j.colsurfa.2021.126143