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1 Ergebnisse
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Understanding and mitigating temperature-induced agglomerat..:
Othman, Ali
;
Kim, Hong Jin
;
Trivedi, Rahul
..
Colloids and Surfaces A: Physicochemical and Engineering Aspects. 691 (2024) - p. 133802 , 2024
Link:
https://doi.org/10.1016/j.colsurfa.2024.133802
RT Journal T1 <Title>Understanding and mitigating temperature-induced agglomeration in silica-based chemical mechanical planarization (CMP) slurry storage</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.colsurfa.2024.133802&Exemplar=1&LAN=DE A1 Othman, Ali A1 Kim, Hong Jin A1 Trivedi, Rahul A1 Kulasingam, Thayalan A1 Seo, Jihoon PB Elsevier BV YR 2024 SN 0927-7757 JF Colloids and Surfaces A: Physicochemical and Engineering Aspects VO 691 SP 133802 LK http://dx.doi.org/https://doi.org/10.1016/j.colsurfa.2024.133802 DO https://doi.org/10.1016/j.colsurfa.2024.133802 SF ELIB - SuUB Bremen
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