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Specific ion effects on copper electroplating:
Giurlani, Walter
;
Fidi, Alberto
;
Anselmi, Erasmo
...
Colloids and Surfaces B: Biointerfaces. 225 (2023) - p. 113287 , 2023
Link:
https://doi.org/10.1016/j.colsurfb.2023.113287
RT Journal T1 <Title>Specific ion effects on copper electroplating</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.colsurfb.2023.113287&Exemplar=1&LAN=DE A1 Giurlani, Walter A1 Fidi, Alberto A1 Anselmi, Erasmo A1 Pizzetti, Federico A1 Bonechi, Marco A1 Carretti, Emiliano A1 Lo Nostro, Pierandrea A1 Innocenti, Massimo PB Elsevier BV YR 2023 SN 0927-7765 JF Colloids and Surfaces B: Biointerfaces VO 225 SP 113287 LK http://dx.doi.org/https://doi.org/10.1016/j.colsurfb.2023.113287 DO https://doi.org/10.1016/j.colsurfb.2023.113287 SF ELIB - SuUB Bremen
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