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1 Ergebnisse
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Leaf area index estimation under wheat powdery mildew stres..:
Liu, Yang
;
An, Lulu
;
Wang, Nan
...
Computers and Electronics in Agriculture. 213 (2023) - p. 108169 , 2023
Link:
https://doi.org/10.1016/j.compag.2023.108169
RT Journal T1
Leaf area index estimation under wheat powdery mildew stress by integrating UAV‑based spectral, textural and structural features
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.compag.2023.108169&Exemplar=1&LAN=DE A1 Liu, Yang A1 An, Lulu A1 Wang, Nan A1 Tang, Weijie A1 Liu, Minjia A1 Liu, Gouhui A1 Sun, Hong A1 Li, Minzan A1 Ma, Yuntao PB Elsevier BV YR 2023 SN 0168-1699 JF Computers and Electronics in Agriculture VO 213 SP 108169 LK http://dx.doi.org/https://doi.org/10.1016/j.compag.2023.108169 DO https://doi.org/10.1016/j.compag.2023.108169 SF ELIB - SuUB Bremen
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