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Novel micro-nano epoxy composites for electronic packaging ..:
Hu, Yang
;
Chen, Chao
;
Wen, Yingfeng
...
Composites Science and Technology. 209 (2021) - p. 108760 , 2021
Link:
https://doi.org/10.1016/j.compscitech.2021.108760
RT Journal T1 <Title>Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.compscitech.2021.108760&Exemplar=1&LAN=DE A1 Hu, Yang A1 Chen, Chao A1 Wen, Yingfeng A1 Xue, Zhigang A1 Zhou, Xingping A1 Shi, Dean A1 Hu, Guo-Hua A1 Xie, Xiaolin PB Elsevier BV YR 2021 SN 0266-3538 JF Composites Science and Technology VO 209 SP 108760 LK http://dx.doi.org/https://doi.org/10.1016/j.compscitech.2021.108760 DO https://doi.org/10.1016/j.compscitech.2021.108760 SF ELIB - SuUB Bremen
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