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1 Ergebnisse
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Simulation of crack propagation in solder layer of IGBT dev..:
Yang, Kai
;
Zhou, Longzao
;
Wu, Fengshun
...
Engineering Fracture Mechanics. 284 (2023) - p. 109260 , 2023
Link:
https://doi.org/10.1016/j.engfracmech.2023.109260
RT Journal T1
Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.engfracmech.2023.109260&Exemplar=1&LAN=DE A1 Yang, Kai A1 Zhou, Longzao A1 Wu, Fengshun A1 Yang, Guang A1 Ding, Liguo A1 Li, Kewei A1 Li, Xuemin PB Elsevier BV YR 2023 SN 0013-7944 JF Engineering Fracture Mechanics VO 284 SP 109260 LK http://dx.doi.org/https://doi.org/10.1016/j.engfracmech.2023.109260 DO https://doi.org/10.1016/j.engfracmech.2023.109260 SF ELIB - SuUB Bremen
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