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1 Ergebnisse
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3D heat conduction-induced postbuckling behaviour of thin-w..:
Do, Vuong Nguyen Van
;
Lee, Chin-Hyung
Engineering Structures. 288 (2023) - p. 116189 , 2023
Link:
https://doi.org/10.1016/j.engstruct.2023.116189
RT Journal T1
3D heat conduction-induced postbuckling behaviour of thin-walled imperfect laminated cylindrical panels reinforced with graphene platelets
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.engstruct.2023.116189&Exemplar=1&LAN=DE A1 Do, Vuong Nguyen Van A1 Lee, Chin-Hyung PB Elsevier BV YR 2023 SN 0141-0296 JF Engineering Structures VO 288 SP 116189 LK http://dx.doi.org/https://doi.org/10.1016/j.engstruct.2023.116189 DO https://doi.org/10.1016/j.engstruct.2023.116189 SF ELIB - SuUB Bremen
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