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Analytical model of thermal stress distribution of bonded s..:
Xiaoyan, Wang
;
Shuang, Zheng
International Journal of Adhesion and Adhesives. 31 (2011) 6 - p. 398-401 , 2011
Link:
https://doi.org/10.1016/j.ijadhadh.2011.03.005
RT Journal T1 <Title>Analytical model of thermal stress distribution of bonded structure under temperature field</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijadhadh.2011.03.005&Exemplar=1&LAN=DE A1 Xiaoyan, Wang A1 Shuang, Zheng PB Elsevier BV YR 2011 SN 0143-7496 JF International Journal of Adhesion and Adhesives VO 31 IS 6 SP 398 OP 401 LK http://dx.doi.org/https://doi.org/10.1016/j.ijadhadh.2011.03.005 DO https://doi.org/10.1016/j.ijadhadh.2011.03.005 SF ELIB - SuUB Bremen
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