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Improvement of adhesion characteristics of copper electrode..:
Ahn, Tae-Chang
;
Hong, Hyun-Soo
;
Kim, Seong-Su
.
International Journal of Adhesion and Adhesives. 112 (2022) - p. 103025 , 2022
Link:
https://doi.org/10.1016/j.ijadhadh.2021.103025
RT Journal T1 <Title>Improvement of adhesion characteristics of copper electrodes on polyvinylidene fluoride films using bovine serum albumin</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijadhadh.2021.103025&Exemplar=1&LAN=DE A1 Ahn, Tae-Chang A1 Hong, Hyun-Soo A1 Kim, Seong-Su A1 Hwang, Hui-Yun PB Elsevier BV YR 2022 SN 0143-7496 JF International Journal of Adhesion and Adhesives VO 112 SP 103025 LK http://dx.doi.org/https://doi.org/10.1016/j.ijadhadh.2021.103025 DO https://doi.org/10.1016/j.ijadhadh.2021.103025 SF ELIB - SuUB Bremen
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