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Bonding of thermoplastic microfluidic device by water assis..:
Tsao, Chia-Wen
;
Chang, Chang-Yen
;
Hu, Wei-Wen
.
International Journal of Adhesion and Adhesives. 125 (2023) - p. 103429 , 2023
Link:
https://doi.org/10.1016/j.ijadhadh.2023.103429
RT Journal T1 <Title>Bonding of thermoplastic microfluidic device by water assistance</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijadhadh.2023.103429&Exemplar=1&LAN=DE A1 Tsao, Chia-Wen A1 Chang, Chang-Yen A1 Hu, Wei-Wen A1 Tian, Yun-Shan PB Elsevier BV YR 2023 SN 0143-7496 JF International Journal of Adhesion and Adhesives VO 125 SP 103429 LK http://dx.doi.org/https://doi.org/10.1016/j.ijadhadh.2023.103429 DO https://doi.org/10.1016/j.ijadhadh.2023.103429 SF ELIB - SuUB Bremen
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