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Effects of wheat flour levels on the thermal curing behavio..:
Wibowo, Eko Setio
;
Park, Byung-Dae
International Journal of Adhesion and Adhesives. 132 (2024) - p. 103694 , 2024
Link:
https://doi.org/10.1016/j.ijadhadh.2024.103694
RT Journal T1 <Title>Effects of wheat flour levels on the thermal curing behavior of Urea–Formaldehyde and Phenol–Formaldehyde resins</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijadhadh.2024.103694&Exemplar=1&LAN=DE A1 Wibowo, Eko Setio A1 Park, Byung-Dae PB Elsevier BV YR 2024 SN 0143-7496 JF International Journal of Adhesion and Adhesives VO 132 SP 103694 LK http://dx.doi.org/https://doi.org/10.1016/j.ijadhadh.2024.103694 DO https://doi.org/10.1016/j.ijadhadh.2024.103694 SF ELIB - SuUB Bremen
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