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Effects of diamond size of CMP conditioner on wafer removal..:

Chul Yang, Ji ; Hoon Choi, Joo ; Hwang, Taewook..
International Journal of Machine Tools and Manufacture.  50 (2010)  10 - p. 860-868 , 2010
Link: https://doi.org/10.1016/j.ijmachtools.2010.06.007