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Evaluation of the wafer polishing pad capacity and lifetime..:

Lee, Eun-Sang ; Cha, Ji-Wan ; Kim, Seong-Hyun
International Journal of Machine Tools and Manufacture.  66 (2013)  - p. 82-94 , 2013
Link: https://doi.org/10.1016/j.ijmachtools.2012.11.003