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A quantitative study of removal mechanism of copper polishi..:
Zhou, Ping
;
Shi, Haosong
;
Wang, Lin
...
International Journal of Mechanical Sciences. 239 (2023) - p. 107878 , 2023
Link:
https://doi.org/10.1016/j.ijmecsci.2022.107878
RT Journal T1 <Title>A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijmecsci.2022.107878&Exemplar=1&LAN=DE A1 Zhou, Ping A1 Shi, Haosong A1 Wang, Lin A1 Hou, Changyu A1 Meng, Lei A1 Di, Hongyu A1 Guo, Dongming PB Elsevier BV YR 2023 SN 0020-7403 JF International Journal of Mechanical Sciences VO 239 SP 107878 LK http://dx.doi.org/https://doi.org/10.1016/j.ijmecsci.2022.107878 DO https://doi.org/10.1016/j.ijmecsci.2022.107878 SF ELIB - SuUB Bremen
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