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Modeling the cure shrinkage–induced warpage of epoxy moldin..:
Lee, Chang-Chun
;
Lin, Hao-Zhou
International Journal of Mechanical Sciences. 268 (2024) - p. 109056 , 2024
Link:
https://doi.org/10.1016/j.ijmecsci.2024.109056
RT Journal T1 <Title>Modeling the cure shrinkage–induced warpage of epoxy molding compound</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijmecsci.2024.109056&Exemplar=1&LAN=DE A1 Lee, Chang-Chun A1 Lin, Hao-Zhou PB Elsevier BV YR 2024 SN 0020-7403 JF International Journal of Mechanical Sciences VO 268 SP 109056 LK http://dx.doi.org/https://doi.org/10.1016/j.ijmecsci.2024.109056 DO https://doi.org/10.1016/j.ijmecsci.2024.109056 SF ELIB - SuUB Bremen
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