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1 Ergebnisse
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Fracture Analysis of Planar Cracks in 3D Thermal Piezoelect..:
Li, Yuan
;
Yan, Shujie
;
Zhao, Minghao
.
International Journal of Mechanical Sciences. 273 (2024) - p. 109212 , 2024
Link:
https://doi.org/10.1016/j.ijmecsci.2024.109212
RT Journal T1 <Title>Fracture Analysis of Planar Cracks in 3D Thermal Piezoelectric Semiconductors</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijmecsci.2024.109212&Exemplar=1&LAN=DE A1 Li, Yuan A1 Yan, Shujie A1 Zhao, Minghao A1 Ren, Jingli PB Elsevier BV YR 2024 SN 0020-7403 JF International Journal of Mechanical Sciences VO 273 SP 109212 LK http://dx.doi.org/https://doi.org/10.1016/j.ijmecsci.2024.109212 DO https://doi.org/10.1016/j.ijmecsci.2024.109212 SF ELIB - SuUB Bremen
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