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Materials removal mechanism for ultra-precise cutting of si..:
Dai, Houfu
;
Peng, WenQiang
International Journal of Refractory Metals and Hard Materials. 123 (2024) - p. 106774 , 2024
Link:
https://doi.org/10.1016/j.ijrmhm.2024.106774
RT Journal T1 <Title>Materials removal mechanism for ultra-precise cutting of single-crystal silicon with natural single-crystal diamond tools by experiment and atomic simulation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijrmhm.2024.106774&Exemplar=1&LAN=DE A1 Dai, Houfu A1 Peng, WenQiang PB Elsevier BV YR 2024 SN 0263-4368 JF International Journal of Refractory Metals and Hard Materials VO 123 SP 106774 LK http://dx.doi.org/https://doi.org/10.1016/j.ijrmhm.2024.106774 DO https://doi.org/10.1016/j.ijrmhm.2024.106774 SF ELIB - SuUB Bremen
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