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1 Ergebnisse
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The interfacial behavior of a thermoelectric thin-film bond..:
Li, Dengke
;
Chen, Peijian
;
Huang, Zaixing
..
International Journal of Solids and Structures. 267 (2023) - p. 112160 , 2023
Link:
https://doi.org/10.1016/j.ijsolstr.2023.112160
RT Journal T1 <Title>The interfacial behavior of a thermoelectric thin-film bonded to an orthotropic substrate</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijsolstr.2023.112160&Exemplar=1&LAN=DE A1 Li, Dengke A1 Chen, Peijian A1 Huang, Zaixing A1 Liu, Hao A1 Chen, Shaohua PB Elsevier BV YR 2023 SN 0020-7683 JF International Journal of Solids and Structures VO 267 SP 112160 LK http://dx.doi.org/https://doi.org/10.1016/j.ijsolstr.2023.112160 DO https://doi.org/10.1016/j.ijsolstr.2023.112160 SF ELIB - SuUB Bremen
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