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3-D thermal modelling applied to stress-induced anisotropy ..:
Pron, H.
;
Bissieux, C.
International Journal of Thermal Sciences. 43 (2004) 12 - p. 1161-1169 , 2004
Link:
https://doi.org/10.1016/j.ijthermalsci.2004.04.006
RT Journal T1 <Title>3-D thermal modelling applied to stress-induced anisotropy of thermal conductivity</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ijthermalsci.2004.04.006&Exemplar=1&LAN=DE A1 Pron, H. A1 Bissieux, C. PB Elsevier BV YR 2004 SN 1290-0729 JF International Journal of Thermal Sciences VO 43 IS 12 SP 1161 OP 1169 LK http://dx.doi.org/https://doi.org/10.1016/j.ijthermalsci.2004.04.006 DO https://doi.org/10.1016/j.ijthermalsci.2004.04.006 SF ELIB - SuUB Bremen
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