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Kinetic study of solid-state interfacial reactions of p-typ..:
Wang, Chao-hong
;
Li, Mei-hau
;
Chiu, Chun-wei
.
Journal of Alloys and Compounds. 767 (2018) - p. 1133-1140 , 2018
Link:
https://doi.org/10.1016/j.jallcom.2018.07.148
RT Journal T1
Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn–Ag–Cu solders
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jallcom.2018.07.148&Exemplar=1&LAN=DE A1 Wang, Chao-hong A1 Li, Mei-hau A1 Chiu, Chun-wei A1 Chang, Tai-yu PB Elsevier BV YR 2018 SN 0925-8388 JF Journal of Alloys and Compounds VO 767 SP 1133 OP 1140 LK http://dx.doi.org/https://doi.org/10.1016/j.jallcom.2018.07.148 DO https://doi.org/10.1016/j.jallcom.2018.07.148 SF ELIB - SuUB Bremen
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