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Residual stress and interface debonding behavior in Si3N4w ..:
Li, Mingxing
;
Mo, Ran
;
Xu, Zeshui
...
Journal of the European Ceramic Society. 44 (2024) 3 - p. 1505-1510 , 2024
Link:
https://doi.org/10.1016/j.jeurceramsoc.2023.09.078
RT Journal T1 <Title>Residual stress and interface debonding behavior in Si3N4w reinforced SiCN composites prepared by the PIP process: A case study</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jeurceramsoc.2023.09.078&Exemplar=1&LAN=DE A1 Li, Mingxing A1 Mo, Ran A1 Xu, Zeshui A1 Zhou, Jie A1 Zhang, Conglin A1 Cui, Xuefeng A1 Ye, Fang A1 Cheng, Laifei A1 Riedel, Ralf PB Elsevier BV YR 2024 SN 0955-2219 JF Journal of the European Ceramic Society VO 44 IS 3 SP 1505 OP 1510 LK http://dx.doi.org/https://doi.org/10.1016/j.jeurceramsoc.2023.09.078 DO https://doi.org/10.1016/j.jeurceramsoc.2023.09.078 SF ELIB - SuUB Bremen
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