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Layer-by-layer assembly of boron arsenide and copper nanofl..:
Cuong Nguyen, Van
;
Nguyen Pham, Vi
;
Thien Nguyen, Chi
...
Journal of Industrial and Engineering Chemistry. 138 (2024) - p. 492-501 , 2024
Link:
https://doi.org/10.1016/j.jiec.2024.04.028
RT Journal T1 <Title>Layer-by-layer assembly of boron arsenide and copper nanoflake-based aramid nanofibers for thermoconductive electromagnetic interference shielding materials with superior mechanical flexibility and flame retardancy</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jiec.2024.04.028&Exemplar=1&LAN=DE A1 Cuong Nguyen, Van A1 Nguyen Pham, Vi A1 Thien Nguyen, Chi A1 Hoang Ai Pham, Le A1 Khiem Nguyen, Duy A1 Thi Kieu Lien, Mai A1 Canh Vu, Minh PB Elsevier BV YR 2024 SN 1226-086X JF Journal of Industrial and Engineering Chemistry VO 138 SP 492 OP 501 LK http://dx.doi.org/https://doi.org/10.1016/j.jiec.2024.04.028 DO https://doi.org/10.1016/j.jiec.2024.04.028 SF ELIB - SuUB Bremen
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